ATCx Electronics for Engineers

The main session will include keynotes by industry leaders presenting insights into the successful strategies they have implemented within their organizations for accelerated, reliable, and sustainable electronic system design.

Look forward to presentations from Dwight Howard, formerly with APTIV LPC, Alice Lin from GN Audio, Gilad Shapira from CADY, Gopakumar Achath from EMA Design Automation, and more.

Altair’s solution for electronic system design will be introduced in this presentation. It covers Flux & FluxMotor for low frequency electromagnetics (EM) and electric motor design, Feko (including WinProp & WRAP) for high frequency EM applications and propagation modelling, HyperSpice (circuit solver), PSIM (power electronics), PollEx (solutions around PCB), EEvision (visualisation of wiring harnesses, schematics, components), and the newly added Silicon Debug Tools. In addition to a brief overview for all these software solutions, highlights of the latest developments and new features will be presented and illustrated with some application examples.

Simulation-driven design changed product development forever, enabling engineers to reduce design iterations, and prototype testing. High Performance Computing (HPC) expanded the opportunity to apply analysis, making large design studies possible within the timing constraints of a program. Now engineering adoption of Artificial Intelligence (AI) and Machine Learning (ML) is transforming product development again. Combination of physics-based simulation-driven design with machine learning, leveraging the latest in high-performance cloud computing, enables industry to explore more and identify high-potential designs – while rejecting low-potential concepts – even earlier in development cycles.

With the increase in connected devices and platforms (such as 5G, 6G, C-V2X, ADAS etc.), advanced computational electromagnetic (CEM) tools have become part of the product design cycle. Now numerical simulations can be performed to evaluate the effects of antenna design, placement, radiation hazard, EMC/EMI, etc. for wide ranging industry applications. Interfacing with propagation tools, system level design can be accomplished that includes operating environment of the devices for device connectivity and throughput. Advent of cloud computing and AI/ML, and convergence with CEM simulations made connected, smart device design faster with reduced time from concept to the market propelling productivity and innovation. Use of cloud computing combined with AI/ML, many design iterations can be performed in a short period and reducing the time to market. This talk focuses on the use of electromagnetic simulations in design of products in various industries that include, consumer electronics, automotive, aerospace, defense and biomedical. This talk will also focus on future trends in cloud computing for physics-based simulations.

EDA has enabled rapid advances in technology across virtually every industry that has evolved today. Technology is evolving even at a faster pace today. Artificial Intelligence has played a increasing role in electronic design automation. The EDA-AI synergy must expand to meet enormous challenges of cost, schedule, complexity, first-time design quality, zero defects, applications imperatives of realiability/durability, safety, functionality in all areas of evolving technology. This Keynote presentation will highlight past examples where significant gains were achieved with EDA/AI and present imperatives for EDA/AI in evolving uture technologies.

Navigating High Tech Electronics Innovation empowers engineers working with compact, high-speed electronics to accelerate time to market and enhance cost efficiency through precise, error-free design decisions. Explore design solutions that address performance and manufacturability from the semiconductor level to the system level to reach optimum designs for improved after-sales reliability.

In the realm of consumer electronics, rapidly innovating novel products has always been a chanllege.
Conventional simulation software’s preprocessing phase has proven time-consuming, especially when dealing with complex models like full device drops. Futhermore, the limitations of single-purpose solvers, e.g. separate purchases are required for structural and fluid analysis, have constrained the potential of simulation engineers.

Since 2018, Jabra start using Altair softwares in product design. By adopting Simlab, the preprocessing efficiency has been improved obviously, allow simulation experts saving time to delve new problem domains. Simlab also functions as a versatile preprocessing tool for fluid and thermal simulations, thus also can be used to solve thermal management chanlleges.

Additionally, the software supports Design of Experiments (DOE) and topology optimization, enabling refined design enhancements.
Empowered by Altair software, even a small-scale simulation team can seamlessly address an array of concerns encompassing structural, thermal, and even optical simulations.

CADY introduces a groundbreaking SaaS system designed to automate the inspection process of electrical schematics. Utilizing proprietary NLP and Computer Vision algorithms, the technology proficiently interprets electronic component datasheets.

When a circuit design is uploaded to the CADY system, it meticulously traces along its nets and pins, cross-referencing against relevant datasheets to ensure adherence to manufacturer’s guidelines. The system generates comprehensive reports, highlighting discrepancies such as missing pull up/down resistors, voltage range violations, communication lines mismatch, potential capacitor breaches, and more.

CADY’s system acts as a meticulous filter, effectively identifying and preventing errors from progressing downstream. By streamlining the manual peer-review inspection process, it significantly reduces time consumption, error risks, and costs associated with re-spin iterations, ultimately accelerating time-to-market for products.

Semiconductor design and processing requires the use of various components.  However, if any of those components fail, it can cause delays in production.  This session will focus on using machine learning to predict the remaining useful life and to plan maintenance actions for an electrostatic chuck to reduce delays caused by component failure.

Traditionally ECAD users weren’t integrated or involved in supply chain. However, with the rising challenges in semiconductor industry around chip shortages, customers have realized the need for integrating ECAD with supply chain. Last time buy and purchasing decision have moved upstream to ECAD designers. Learn how to validate design components and select components for your designs based on part availability, lifecycle status and most importantly lead time all from within your design tool. We will demonstrate how you can make supply chain resilience an essential part of your design process.

Stacking multiple dies, 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density.

However, these advancements come with several challenges, including thermal management issues.

Multiphysics suites from Altair assist designers in optimizing thermal management strategies and minimizing thermal stress-induced failures.

Future-Proofing Aerospace and Automotive Electronic Design offers a deep dive into electronic system design challenges in the automotive and aerospace industries. Learn how engineers use simulation and data analytics to handle connected end-to-end design workflows early in the design cycle where reliability and robustness can be addressed before products reach the market.

PCB verification identifies and suggests corrections early in the design stage. Through verification, users check a pre-prototype layout design against geometrical design requirements and best practices. As an outcome, the risk for product functional, electrical, and assembly issues is reduced. PCB verification is addressing harsh operating conditions for a vehicle, such as temperature fluctuations, humidity, vibration, and electromagnetic interference through electrical validity and manufacturability.

Technical cleanliness is the level of purity required in production to ensure the reliable performance of products or systems.
Altair PollEx offers a range of verification features including technical cleanliness.

Those features do not only simplify and automate your design verification, but also greatly reduces design cost by reducing design iterations.

Until recently, the only way to understand EMI issues was through hardware testing. The solution applicable for a single laboratory prototype may not resolve big volume production. It takes a lot of time, to disassembly product, re-solder components, assembly the product bac and repeat measurements. This approach is costly and time consuming when it comes to tackling EMC-CE challenges. Simulation is now able to provide actionable design decisions for conducted EMI at the beginning of the design cycle to reduce the risk for failure and costs – including the expense of hardware certification. It may as well help to find and address root casue for noncompliance’s identified though laboratory testing.

If you’re not a signal integrity (SI) expert, the thought of EMI/EMC issues might bring you chills. As PCB simulation tools continue to improve, it’s important to incorporate signal integrity checks early in the design process. Instead of waiting for the analysis results after laying out your PCB, why not implement best practices into your verification process.In this workshop, we will look at common EMI/EMC issues, and how they can be traced back to design best practices. We also look at how we can use rule based verification to automatically check for indicators, saving time and money. This workshop is meant for beginner to mid-level PCB designers and Signal Integrity engineers. The purpose of this workshop is to add a skillset that helps free up the time of the Signal Integrity Expert. This workshop also encourages users to add best practices into their current workflow by adopting this methodology. This workshop can be done with generic DFE and DFM tools. Attendees will learn:
• The effect of PCB miniaturization on signal integrity.
• Common DRC setups to identify EMC errors early.
• How to improve quality by incorporating automated verification for EMI/EMC